2026 Humanoid Robot Thermal Control and Energy Efficiency Optimization Forum

Official Forum

Date: December 10, 2026

Forum Theme: Real Challenges and Breakthrough Paths for the Large-Scale Implementation of Liquid Cooling

Forum Introduction

With the rapid development of AI computing power, liquid cooling has become a key technology for data centers to achieve efficient heat dissipation and support high-density computing deployment. As liquid cooling technology transitions from pilot demonstrations to large-scale commercial application, the industry still faces many practical challenges in strategic positioning, technical standards, full-lifecycle costs, deployment reliability, hardware thermal adaptation, operations and maintenance systems, and commercial implementation.

This official forum focuses on the real industrial issues in the large-scale implementation of liquid cooling, bringing together stakeholders across the industry chain, including computing infrastructure, liquid cooling technology, cooling materials, engineering contractors, and data center operations. Centering on core topics such as industry outlook, technology routes, cost decomposition, risk management, system-level thermal redesign, operations transformation, and commercial implementation, the forum facilitates knowledge sharing and discussion, addresses industry pain points head-on, and explores feasible breakthrough paths to support the high-quality, large-scale development of the liquid-cooled data center industry.

Forum Agenda

13:00-13:10 Opening Address

13:10-13:35 Keynote Speech: From “Optional” to “Essential” — The Industry Gap and Strategic Outlook for Large-Scale Liquid Cooling

13:35-14:00 Keynote Speech: The Battle of Liquid Cooling Technology Routes and the Standardization Dilemma

14:00-14:25 Keynote Speech: Total Cost of Ownership (TCO) Analysis and Cost Decomposition for Liquid-Cooled Data Centers

14:25-14:35 Coffee Break

14:35-15:00 Keynote Speech: Leakage Risks and Reliability Engineering Practices in Large-Scale Liquid Cooling Deployment

15:00-15:25 Keynote Speech: System-Level Thermal Redesign: The Cooling Crisis of Memory, SSDs, and Voltage Regulators After Liquid Cooling

15:25-15:50 Keynote Speech: The Operational Complexity of Liquid Cooling Systems: The Capability Gap and Hidden Costs from “Air” to “Liquid”

15:50-16:50 Panel Discussion: The “Last Mile” of Liquid Cooling Scale-Up: Who Pays for Adoption, Delivery, and Operations?

Note: The above agenda is tentative; any adjustments to the forum content and schedule are subject to the final announcement at the event. The panel discussion will invite representatives from internet vendors, cloud vendors, coolant and material companies, liquid cooling component manufacturers, data center design institutes, and EPC contractors across the industry chain to join the dialogue.